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MICRO LED VERIFICATION SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND MICRO LED VERIFICATION METHOD USING SAME
MICRO LED VERIFICATION SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND MICRO LED VERIFICATION METHOD USING SAME
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机译:微型LED验证基板,其制造方法以及使用相同方法的微型LED验证方法
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摘要
Disclosed in the present specification are an apparatus and a method capable of quickly verifying a plurality of micro LEDs. An LED verification substrate according to the present specification is a micro LED verification substrate having a plurality of verification chips, wherein each verification chip can comprise: a first contact deposited on the upper side of a lower substrate; a first passivation layer deposited on the upper side of the first contact; a second contact deposited on the upper side of the first passivation layer; a second passivation layer deposited on the upper side of the second contact; a first bump electrically connected to the first contact and protruding above the upper surface of the second passivation layer; and a second bump electrically connected to the second contact and protruding above the upper surface of the second passivation layer.
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