FLUID-BASED COOLING DEVICE FOR COOLING AT LEAST TWO DISTINCT FIRST HEAT-GENERATING ELEMENTS OF A HEAT SOURCE ASSEMBLY

摘要

A fluid-based cooling device (10) for cooling at least two distinct first heat-generating elements (110, 111) of a heat source assembly (100) is provided. The heat source assembly (100) is in thermal contact with the fluid-based cooling device (10). The fluid- based cooling device comprises (10) a first plate (16), a heat sink structure (18) and a second plate (14). The first plate (16) is configured for thermally contacting the heat source assembly (100). The heat sink structure (18) is arranged on or in the first plate (16). The second plate (14) is configured for directing a flow of a cooling fluid to the heat sink structure (18). The second plate (14) is arranged on the heat sink structure (18). The heat sink structure (18) comprises at least two heat sink structure portions (20, 21) each corresponding to an associated one of the at least two distinct first heat- generating elements (110, 111). The second plate (14) comprises at least two fluid in- let opening regions (26, 27), wherein each of the fluid inlet opening regions (26, 27) is associated with a corresponding heat sink structure portion (20, 21) of the at least two heat sink structure portions (20, 21).