Reflow Soldering Machine Having Droop Prevention Structure For Circuit Board

摘要

A reflow soldering apparatus including a circuit board deflection preventing structure is disclosed. A reflow soldering apparatus 100 according to an embodiment of the present invention is a reflow soldering apparatus 100 that houses a PCB (printed circuit board) 10 and performs soldering by applying a high temperature or a remote infrared ray, An inlet 111 into which the PCB 10 is introduced and an outlet 112 through which the PCB 10 is positioned in a direction opposite to the inlet 111 and a receiving portion 113); A heating unit 120 located inside the storage unit 113 of the case 110 and applying heat to the PCB 10 conveyed by the transfer unit 130; A pair of conveying rails 131 and 132 and a pair of conveying rails 131 and 132 mounted in the housing part 113 of the case 110 at a distance corresponding to the width of the PCB 10, (130) having conveyor chains (161, 162) mounted for slidable driving and conveying the PCB (10) with a part of both sides of the PCB (10) being held; And a deflection preventing part 150 installed adjacent to the conveying rails 131 and 132 for applying a predetermined tensile force to both sides of the PCB 10 by changing a distance between the conveyor chains 161 and 162 To be a point of composition. According to the present invention, it is possible to provide a reflow soldering apparatus having a structure capable of preventing a PCB from being squeezed in a high temperature environment.