IC DRAM SOC PACKAGING DRAM AND SOC IN AN IC PACKAGE

摘要

There is provided an integrated circuit package comprising a first memory die, a second memory die, a first substrate and a second substrate, wherein the first memory die has a first set of connecting portions, The first substrate having a first opening and a second opening, the first substrate also having a first opening and a second opening, the first substrate having a first opening and a second opening, A third set of connection portions connected to the first set of connection portions of the second memory die and a fourth set of connection portions connected to the second set of connection portions of the second memory die through the second opening, A first integrated circuit is disposed on the substrate. A first substrate is coupled to the second substrate such that a first integrated circuit is disposed between the first substrate and the second substrate.