PFC PACKAGED FAST INVERSE DIODE COMPONENT FOR PFC APPLICATIONS

摘要

A novel four-terminal packaged semiconductor device is particularly useful in a 400 volt DC output PFC boost converter circuit. Within the body of the package, an NFET die and a fast inverse diode die are mounted such that a bottom side drain electrode of the NFET is electrically coupled to a bottom side P type anode region of the inverse diode via a die attach tab. A first terminal T1 is coupled to the die attach tab, a second terminal T2 is coupled to a gate of the NFET die, a third terminal T3 is coupled to a source of the NFET die, and a fourth terminal T4 is coupled to the top side cathode electrode of the fast inverse diode die. Due to a novel P+ type charge carrier extraction region of the inverse diode die, the packaged device is fast and has a low reverse leakage current when applied to the PFC boost converter circuit.