首页> 外国专利> Anhydride Epoxy Curing Agent with Imidazole Salt Additives for Epoxy Resin Systems

Anhydride Epoxy Curing Agent with Imidazole Salt Additives for Epoxy Resin Systems

机译:含咪唑盐添加剂的酸酐环氧固化剂,用于环氧树脂体系

摘要

At least one imidazole salt represented by the structure: wherein R, R 'is H or lower alkyl of 1 to 20 carbon atoms, preferably 1 to 7 carbon atoms, haloalkyl (1 (1-7 carbon atoms), ester group (s), substituted alkyl, and X - is a carboxylate anion of 1-40 carbon atoms; And at least one anhydride curing agent. The disclosed imidazole salts provide improved latency for epoxy systems while maintaining reactivity at elevated temperatures when combined with anhydride curing agents. Also disclosed are methods for forming epoxy compositions, cured epoxy products, and cured epoxy products.
机译:至少一种咪唑盐,其结构如下:其中R,R'为H或1至20个碳原子,优选1至7个碳原子的低级烷基,卤代烷基(1(1至7个碳原子),酯基,取代的烷基和X -是1至40个碳原子的羧酸根阴离子;以及至少一种酸酐固化剂。还公开了形成环氧组合物,固化的环氧产物和固化的环氧产物的方法。

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