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PCB manufacturing method thereof and method for measuring quality of PCB

机译:PCB的制造方法及测量PCB质量的方法

摘要

According to various embodiments of the present invention, a printed circuit board comprises: a plurality of layers in which at least one opening is formed; and at least one antenna included in at least one layer of the plurality of layers. The at least one opening can be positioned within a designated distance from the at least one antenna, and can be formed by passing through at least one of the plurality of layers.
机译:根据本发明的各种实施例,一种印刷电路板包括:多层,其中形成至少一个开口;以及至少一个天线包括在多个层的至少一层中。所述至少一个开口可以被定位在距所述至少一个天线的指定距离内,并且可以通过穿过所述多个层中的至少一个而形成。

著录项

  • 公开/公告号KR20190037827A

    专利类型

  • 公开/公告日2019-04-08

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20170127552

  • 发明设计人 HONG EUN SEOK;KIM SUNG JIN;

    申请日2017-09-29

  • 分类号H05K1/02;G01R1/067;G01R31/28;H01Q1/38;H05K13/08;

  • 国家 KR

  • 入库时间 2022-08-21 11:51:12

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