Embedded multilayer ceramic electronic component manufacturing method thereof and print circuit board having embedded multilayer ceramic electronic component

摘要

The present invention relates to a multilayer ceramic electronic component, which comprises: a body having first and second surfaces which face each other, third and fourth surfaces which are connected to the first and second surfaces and face each other, fifth and sixth surfaces which are connected to the first and second surfaces, connected to the third and fourth surfaces, and face each other, and including a plurality of dielectric layers and a plurality of first and second internal electrodes which are disposed with the dielectric layer therebetween so as to be alternately exposed through the third and fourth surfaces, respectively; and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and including first and second connected portions connected to the first and second internal electrodes, respectively, and first and second band portions extended from the first and second connected portions to portions of at least one of the first and second surfaces of the body, respectively. The first and second external electrodes include first and second conductive layers which are disposed on the body and first and second plating layers which are disposed on the first and second conductive layers, respectively, and cut surfaces of end portions of external electrodes are flat. Thus, the deviation of the gap between the band portions is minimized.