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PATCH FOR TRANSDERMAL DRUG DELIVERY, MANUFACTURING METHOD THEREOF, AND TRANSDERMAL DRUG DELIVERY SYSTEM USING PATCH
PATCH FOR TRANSDERMAL DRUG DELIVERY, MANUFACTURING METHOD THEREOF, AND TRANSDERMAL DRUG DELIVERY SYSTEM USING PATCH
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机译:皮下给药的贴剂,其制造方法以及使用贴剂的皮下给药系统
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摘要
According to the present invention, a manufacturing method of a patch for transdermal drug delivery includes: a step (a) of forming a circuit pattern with silver paste on one surface of a heat resistance substrate; a step (b) of forming a silver (Ag) electrode layer by thermally treating the heat resistance substrate having the circuit pattern; a step (c) of transferring the silver (Ag) electrode layer to a flexible film; a step (d) of laminating the surface layer of a thermoplastic resin material coated with a hot melt with the silver (Ag) electrode layer transferred to the flexible film; a step (e) of removing the flexible film; and a step (f) of laminating a fiber layer on the surface from which the flexible film is removed. The present invention has effects of: minimizing side effects on skin capable of being generated by adhesive since the present invention does not include adhesive; additionally containing drug as much as adhesive compared to an existing transdermal patch; and providing a patch including a printed circuit board having excellent electrical conductivity and flexibility.;COPYRIGHT KIPO 2019
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