首页> 外国专利> PATCH FOR TRANSDERMAL DRUG DELIVERY, MANUFACTURING METHOD THEREOF, AND TRANSDERMAL DRUG DELIVERY SYSTEM USING PATCH

PATCH FOR TRANSDERMAL DRUG DELIVERY, MANUFACTURING METHOD THEREOF, AND TRANSDERMAL DRUG DELIVERY SYSTEM USING PATCH

机译:皮下给药的贴剂,其制造方法以及使用贴剂的皮下给药系统

摘要

According to the present invention, a manufacturing method of a patch for transdermal drug delivery includes: a step (a) of forming a circuit pattern with silver paste on one surface of a heat resistance substrate; a step (b) of forming a silver (Ag) electrode layer by thermally treating the heat resistance substrate having the circuit pattern; a step (c) of transferring the silver (Ag) electrode layer to a flexible film; a step (d) of laminating the surface layer of a thermoplastic resin material coated with a hot melt with the silver (Ag) electrode layer transferred to the flexible film; a step (e) of removing the flexible film; and a step (f) of laminating a fiber layer on the surface from which the flexible film is removed. The present invention has effects of: minimizing side effects on skin capable of being generated by adhesive since the present invention does not include adhesive; additionally containing drug as much as adhesive compared to an existing transdermal patch; and providing a patch including a printed circuit board having excellent electrical conductivity and flexibility.;COPYRIGHT KIPO 2019
机译:根据本发明,一种用于透皮药物递送的贴剂的制造方法包括:步骤(a):在耐热基板的一个表面上用银浆形成电路图案;步骤(b),通过对具有电路图案的耐热性基板进行热处理来形成银(Ag)电极层。步骤(c),将银(Ag)电极层转移到柔性膜上;步骤(d):将涂有热熔体的热塑性树脂材料的表面层与转移到柔性膜上的银(Ag)电极层层压在一起; (e)去除柔性膜的步骤;步骤(f)是在去除了柔性膜的表面上层叠纤维层。本发明具有以下效果:由于本发明不包括粘合剂,因此使由粘合剂产生的皮肤副作用最小化。与现有的透皮贴剂相比,还含有与粘合剂一样多的药物;并提供包括具有优异导电性和柔韧性的印刷电路板的贴片。; COPYRIGHT KIPO 2019

著录项

  • 公开/公告号KR20190070828A

    专利类型

  • 公开/公告日2019-06-21

    原文格式PDF

  • 申请/专利权人 PARK CHAN HOO;

    申请/专利号KR20180014010

  • 发明设计人 PARK CHAN HOOKR;

    申请日2018-02-05

  • 分类号A61K9/70;H05K3/10;

  • 国家 KR

  • 入库时间 2022-08-21 11:50:34

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