LED Microchip LED element faulty repair method

摘要

The present invention relates to a method for repairing a defective LED device of a microchip, which isolates a microchip having a defective LED device from neighboring microchips such that only the defective LED device can be repaired. The method comprises: a step (S10) of seating a fence jig around a microchip having an LED device determined as a defect among a plurality of microchips mounted on a PCB to block the microchip from the outside; a step (S20) of irradiating the inside of the fence jig with a laser to melt a soldering portion of the LED device; a step (S30) of spraying air toward the LED device, in which the solder portion is melted, through an air blower tube penetrated into the fence jig to separate the defective LED device from the microchip; a step (S40) of suctioning the defective LED device separated from the microchip through a suction tube penetrated into the fence jig; and a step (S50) of applying a solder paste to the microchip, seating a new LED device thereon, and irradiating the microchip with a laser to solder the LED device to the microchip. Thus, tact time for the repair process can be significantly reduced.