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Method for repairing backing plate for sputtering target, sputtering target using maintenance-completed backing plate and maintenance-completed backing plate
Method for repairing backing plate for sputtering target, sputtering target using maintenance-completed backing plate and maintenance-completed backing plate
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机译:溅射靶的背板的修复方法,使用维护完成的背板的溅射靶和维护完成的背板
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摘要
An embodiment of the present invention is a method of repairing a backing plate 20 including a base 22 made of copper having a defective portion 24 and includes a step of polishing the surface of the defected portion 24, And a step of spraying and depositing the repairing particles onto the defects (24) after the step of polishing, wherein the repairing particles include copper particles and ceramic particles.
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