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Method for repairing backing plate for sputtering target, sputtering target using maintenance-completed backing plate and maintenance-completed backing plate

机译:溅射靶的背板的修复方法,使用维护完成的背板的溅射靶和维护完成的背板

摘要

An embodiment of the present invention is a method of repairing a backing plate 20 including a base 22 made of copper having a defective portion 24 and includes a step of polishing the surface of the defected portion 24, And a step of spraying and depositing the repairing particles onto the defects (24) after the step of polishing, wherein the repairing particles include copper particles and ceramic particles.
机译:本发明的实施例是一种修复背板20的方法,该背板20包括具有缺陷部分24的由铜制成的基底22,并且包括对缺陷部分24的表面进行抛光的步骤以及喷涂和沉积该修复剂的步骤。在抛光步骤之后,将颗粒沉积在缺陷(24)上,其中修复颗粒包括铜颗粒和陶瓷颗粒。

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