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Polymer with low dielectric constant and molecular structure design method to reduce polymer dielectric constant

机译:低介电常数聚合物及降低聚合物介电常数的分子结构设计方法

摘要

The present invention discloses a polymer having a low dielectric constant and a molecular structure design method for reducing polymer dielectric constant, which utilizes the design possibilities of the polymer molecular chain pendant group, and is a straight chain in the pendant benzene ring or biphenyl chain segment structure meta position. Introduces rigid functional groups, loose rotation of pendant benzene rings to form larger size free volume electron holes in the material, inhibits molecular chain stacking, and further reduces polymer material dielectric constant . The design method of the present invention is applied to high performance polymer materials, which are simple and frequently seen, can be applied to low dielectric polymer materials, and applied to high technology industries such as electronics, microelectronics, information and aerospace, and especially large scale integrated circuits. Applies to the area.
机译:本发明公开了一种具有低介电常数的聚合物和用于降低聚合物介电常数的分子结构设计方法,其利用了聚合物分子链侧基的设计可能性,并且是在侧苯环或联苯链段中的直链。结构元位置。引入刚性官能团,苯环侧链的松动旋转以在材料中形成更大尺寸的自由体积电子空穴,抑制分子链堆积,并进一步降低聚合物材料的介电常数。本发明的设计方法应用于简单且经常见到的高性能聚合物材料,可以应用于低介电聚合物材料,并且应用于电子,微电子,信息和航空航天等高科技行业,尤其​​是大型工业。规模集成电路。适用于该区域。

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