3D Photo-curable resin ink composition for 3D printing with heat resisting and high mechanical property comprising dicyclopentadien epoxy acrylate

摘要

The present invention relates to a photo-curable resin ink composition for 3D printing with excellent heat resistance and mechanical properties comprising dicyclopentadiene epoxy acrylate and, more specifically, to a photo-curable resin ink composition for 3D printing with excellent heat resistance and mechanical properties comprising dicyclopentadiene epoxy acrylate, which performs curing of radical and cationic methods by ultraviolet irradiation at the same time, by including epoxy acrylate which introduces acrylate by completely opening an epoxy group of a dicyclopentadiene epoxy resin or epoxy acrylate having an epoxy group and an acryl group at the same time by partially opening the epoxy group and an acrylic monomer.