首页> 外国专利> MODULE INTEGRATION BASED SMART FLOOR TILES AND SMART FLOOR SYSTEM USING THE SAME

MODULE INTEGRATION BASED SMART FLOOR TILES AND SMART FLOOR SYSTEM USING THE SAME

机译:基于模块集成的智能地板砖和使用该模块的智能地板系统

摘要

A smart floor tile and a smart floor system using the same are disclosed. The smart floor according to the system is formed by combining a plurality of smart floor tiles each including a transducer capable of sensing the external environment or stimulating the external environment. The master device is connected to the plurality of smart floor tiles in accordance with an I 2 C (Inter-Integrated Circuit) communication method. A controller is connected to the master device and controls the transducers of the plurality of smart floor tiles through the master device. The smart floor tile includes a transducer module including the transducer. The tile connector is for signal coupling with other smart floor tiles. The communication cable is for signal connection between the tile connector and the transducer module
机译:公开了一种智能地板砖和使用该智能地板砖的智能地板系统。根据该系统的智能地板是通过组合多个智能地板砖而形成的,每个智能地板砖包括能够感测外部环境或刺激外部环境的换能器。主设备根据I 2 C(集成电路间)通信方法连接到多个智能地板砖。控制器连接到主设备并通过主设备控制多个智能地板砖的换能器。智能地板砖包括包括换能器的换能器模块。瓷砖连接器用于与其他智能地板砖进行信号耦合。通信电缆用于瓦片连接器和传感器模块之间的信号连接

著录项

  • 公开/公告号KR101974909B1

    专利类型

  • 公开/公告日2019-05-03

    原文格式PDF

  • 申请/专利权人 한국과학기술원;

    申请/专利号KR20170007944

  • 发明设计人 장성주;

    申请日2017-01-17

  • 分类号G06Q50/10;A63F13/428;G09F13/20;H04W4/02;H05B37/02;

  • 国家 KR

  • 入库时间 2022-08-21 11:48:39

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