The method for producing an ultra thin copper foil according to the present invention comprises the steps of: (i) forming a primer pretreatment layer (P) on one side of a synthetic resin film (A); (Ii) forming a copper deposition layer (B) having a purity of 90 to 99.99% and a thickness of 1.5 to 2.0 占 퐉 on the primer pretreatment layer (P) by a vacuum deposition method; (B) from a laminate (L) in which a primer pretreatment layer (P) and a copper vapor deposition layer (B) are sequentially formed on one side of a synthetic resin film (A) by a roll- ). The present invention can easily produce an ultra thin copper foil using a simple facility. The ultra-thin copper foil manufactured by the present invention has an ultra-thin thickness of 1.5-2.0 μm and a flatness of ± 2% / m 2. Therefore, the ultra-thin copper foil manufactured by the present invention is excellent in flexibility and post-treatment and has a purity of 90 to 99.99% To realize the electrical characteristics inherent to copper (Cu).
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机译：根据本发明的超薄铜箔的制造方法包括以下步骤：（i）在合成树脂膜（A）的一侧上形成底漆预处理层（P）; （ii）通过真空蒸镀法在底漆预处理层（P）上形成纯度为90〜99.99％，厚度为1.5〜2.0占퐉的铜蒸镀层（B）。 （B）由层压体（L）制成，其中通过辊涂在合成树脂膜（A）的一侧顺序形成底漆预处理层（P）和铜气相沉积层（B）。本发明可以使用简单的设备容易地制造超薄铜箔。通过本发明制造的超薄铜箔的厚度为1.5〜2.0μm，平坦度为±2％/ m 2。因此，通过本发明制造的超薄铜箔的柔软性优异。并进行后处理，纯度为90％至99.99％，以实现铜（Cu）固有的电气特性。
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