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PVD EDGE UNIFORMITY IMPROVEMENT IN PVD ARRAY COATERS

机译:PVD阵列涂层机中PVD边缘均匀性的改进

摘要

An apparatus for depositing a material on a substrate is described. The apparatus includes a deposition array 222 having three or more cathodes 122 and the deposition array includes a first outer deposition assembly 301 comprising at least a first of three or more cathodes ); A second outer deposition assembly (302) opposite the first outer deposition assembly, wherein the second outer deposition assembly comprises at least a second cathode of three or more cathodes, and a second outer deposition assembly (302) positioned between the first outer deposition assembly and the second outer deposition assembly , And an inner deposition assembly (303) comprising at least one inner cathode. At least one of the first outer deposition assembly 301 and the second outer deposition assembly 302 is configured to deposit the material at a higher rate than the inner deposition assembly 303 on the same substrate at the same time.
机译:描述了一种用于在基板上沉积材料的设备。该设备包括具有三个或更多个阴极122的沉积阵列222,并且该沉积阵列包括第一外部沉积组件301,该第一外部沉积组件301包括三个或更多个阴极中的至少一个。与第一外部沉积组件相对的第二外部沉积组件(302),其中第二外部沉积组件包括至少三个或更多个阴极的第二阴极,以及位于第一外部沉积组件和第二外部沉积组件之间的第二外部沉积组件(302)。第二外部沉积组件,以及内部沉积组件(303),其包括至少一个内部阴极。第一外部沉积组件301和第二外部沉积组件302中的至少一个配置为以比内部沉积组件303更高的速率同时在同一基板上沉积材料。

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