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Hydrogenated block copolymer, Polypropylene resin composition using the same, and its molded object

机译:氢化嵌段共聚物,使用其的聚丙烯树脂组合物及其成型体

摘要

The present invention provides a hydrogenated block copolymer having, in a molecule, a polymer block (S) mainly composed of vinyl aromatic compound units and a polymer block (B) mainly composed of conjugated diene compound units, in the hydrogenated block copolymer described above. Content of a polymer block (S) is 5-20 mass%, content of the said polymer block (B) is 80-95 mass%, The said polymer block (B) makes a polymer block (B1) and a polymer block (B2) It includes, the vinyl bond amount before the hydrogenation of the polymer block (B1) is 30 to 60 mol%, the vinyl bond amount before the hydrogenation of the polymer block (B2) is more than 60 to 100 mol%, in the hydrogenated block copolymer, Content of a polymer block (B1) is 5-60 mass%, content of the said polymer block (B2) is 30-85 mass%, and content of the structure represented by following formula (1) in the said hydrogenated block copolymer is Within 40 100 wt.%, Provides a hydrogenation rate of the hydrogenated block copolymer at least 70 mol%, the hydrogenated block copolymer. (SB)... Formula (1) (In formula (1), S means a polymer block (S) and B means a polymer block (B).)
机译:本发明提供了一种氢化嵌段共聚物,其在分子中具有在上述氢化嵌段共聚物中主要由乙烯基芳族化合物单元组成的聚合物嵌段(S)和主要由共轭二烯化合物单元组成的聚合物嵌段(B)。聚合物嵌段(S)的含量为5〜20质量%,所述聚合物嵌段(B)的含量为80〜95质量%,所述聚合物嵌段(B)为聚合物嵌段(B1)和聚合物嵌段(B)。 B2)包括,聚合物嵌段(B1)的氢化前的乙烯基键量为30〜60mol%,聚合物嵌段(B2)的氢化前的乙烯基键量为60〜100mol%以上。氢化嵌段共聚物中,聚合物嵌段(B1)的含量为5〜60质量%,上述聚合物嵌段(B2)的含量为30〜85质量%,下式(1)表示的结构的含量。所述氢化嵌段共聚物在40100wt。%以内,使氢化嵌段共聚物(氢化嵌段共聚物)的氢化率为至少70mol%。 (SB)...式(1)(式(1)中,S是聚合物嵌段(S),B是聚合物嵌段(B)。)

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