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COMPOUND CONTAINING PHENOLIC HYDROXY GROUP COMPOSITION CONTAINING PHENOLIC HYDROXY GROUP RESIN CONTAINING METHACRYLOYL GROUP CURABLE COMPOSITION AND CURED PRODUCT THEREOF AND RESIST MATERIAL
COMPOUND CONTAINING PHENOLIC HYDROXY GROUP COMPOSITION CONTAINING PHENOLIC HYDROXY GROUP RESIN CONTAINING METHACRYLOYL GROUP CURABLE COMPOSITION AND CURED PRODUCT THEREOF AND RESIST MATERIAL
The (meth) acryloyl group containing resin excellent in heat resistance, and the phenolic hydroxyl group containing compound used as the raw material are provided. General formula (1) [Wherein, R 1 , R 2 and R 3 are each independently an alkyl group having 1 to 8 carbon atoms, m and n are each independently an integer of 1 to 4, and p is an integer of 0 to 4; And V is a hydrogen atom, a (meth) acryloyloxy group or a hydroxyl group, and W, X and Y are each independently a (meth) acryloyloxy group or a hydroxyl group.] The phenolic hydroxyl group containing compound which has a molecular structure shown by which at least one of V, W, X, and Y is a hydroxyl group, and at least one of V, W, X, and Y is a (meth) acryloyloxy group.
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