An embedded component multilayer polymer composite device, method for making encapsulated component multilayer polymer composites, and apparatus for making multilayer composite component polymer composites

摘要

A polymer composite device comprises a first thermoplastic cover layer of a polymeric material having a first softening temperature and a second thermoplastic covering layer of a polymeric material having a second softening temperature. Furthermore, the polymer composite device comprises a carrier layer, which is arranged between the first cover layer and the second cover layer. An inner layer having at least a first inner layer thermoplastic layer of a polymer material having a third softening temperature is disposed between the first cover layer and the second cover layer. The inner layer at least partially surrounds the carrier layer in a material-locking manner. The third softening temperature is less than the first softening temperature and less than the second softening temperature.