首页> 外国专利> The invention relates to an electronic assembly comprising a printed circuit board with electronic components and an element for covering the electronic components

The invention relates to an electronic assembly comprising a printed circuit board with electronic components and an element for covering the electronic components

机译:电子组件技术领域本发明涉及一种电子组件,其包括具有电子组件的印刷电路板和用于覆盖电子组件的元件。

摘要

The invention relates to an electronic assembly (E) comprising a printed circuit board (2) with electronic components (7) arranged on a printed circuit board surface (8) and an element (1) arranged on the printed circuit board (2) for covering the electronic components (7). wherein the assembly (E) is at least partially encapsulated with an encapsulation material (4), the covering element (1) having a printed circuit board surface (2) and spatially separated from the encapsulation material (4) cavity (3), in which between the circuit board surface ( 8) and the cover element (1) a contact spring (5) is arranged.
机译:本发明涉及一种电子组件(E),其包括:印刷电路板(2),其具有布置在印刷电路板表面(8)上的电子部件(7);以及布置在印刷电路板(2)上的元件(1),用于覆盖电子元件(7)。其中,组件(E)至少部分地被封装材料(4)封装,覆盖元件(1)具有印刷电路板表面(2),并且在空间上与封装材料(4)的空腔(3)分开。在电路板表面(8)和盖元件(1)之间装有一个接触弹簧(5)。

著录项

  • 公开/公告号DE102017221864A1

    专利类型

  • 公开/公告日2019-06-06

    原文格式PDF

  • 申请/专利权人 ZF FRIEDRICHSHAFEN AG;

    申请/专利号DE201710221864

  • 发明设计人 DIRK RASCHKE;

    申请日2017-12-05

  • 分类号H05K1/02;H05K3/28;H05K3/30;H05K5/03;H05K9;

  • 国家 DE

  • 入库时间 2022-08-21 11:45:02

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