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BRAZING CREAM, PROCESS FOR PREPARING SUCH A BRAZING CREAM, AND BRAZING METHOD USING THE SAME

机译:钎焊膏,制备这种钎焊膏的过程以及使用钎焊膏的方法

摘要

The invention relates to a solder cream containing, in a vehicle, particles of a brazing metal alloy having a melting temperature of 260 ° C or less, and metal formate particles having a lower decomposition temperature or equal to the melting temperature of the brazing metal alloy plus 30 ° C. Depending on the metal formate used, this solder cream can be used at a lower brazing temperature, or the solder that it allows to form has an increased resistance to tearing stresses at the brazing temperature. This solder cream is especially of great interest for the manufacture of double-sided electronic cards.
机译:焊膏技术领域本发明涉及一种焊膏,其在车辆中包含熔化温度为260℃以下的钎焊金属合金颗粒,以及分解温度较低或等于该钎焊金属合金的熔化温度的金属甲酸盐颗粒。再加上30°C。根据所用金属甲酸盐的不同,可以在较低的钎焊温度下使用该焊膏,或者允许形成的焊锡在钎焊温度下具有更高的抗撕裂应力能力。对于双面电子卡的制造,这种焊锡膏尤其令人关注。

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