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METHOD AND APPARATUS FOR TRANSFERRING INFORMATION WITHIN AND BETWEEN SYSTEM-ON-CHIPS VIA INTRA-CHIP AND INTER-CHIP HOPPING BUSES
METHOD AND APPARATUS FOR TRANSFERRING INFORMATION WITHIN AND BETWEEN SYSTEM-ON-CHIPS VIA INTRA-CHIP AND INTER-CHIP HOPPING BUSES
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机译:通过芯片内和芯片间跳跃总线在芯片上系统内和芯片间传递信息的方法和装置
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摘要
A system including a first system-on-chip (SoC) and a second SoC. The first SoC includes a first module and a second module. The second module is separate from the first module. The second module is in communication with the first module via a first bus. The first bus is internal to the first SoC. The second SoC is separate from the first SoC. The second SoC is in communication with the first SoC via a second bus. The second bus is external to both the first SoC and the second SoC. The first bus and the second bus are configured to use a same communication protocol to respectively transfer information (i) between the first module and the second module via the first bus and internally within the first SoC and (ii) between the first SoC and the second SoC via the second bus.
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