METALLIC MATERIAL FOR ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING SAID METALLIC MATERIAL, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT IN WHICH SAID METALLIC MATERIAL IS USED

摘要

The present invention provides a metallic material for electronic components having a low adhesive wear. The metallic material for electronic components comprises a base material, on the base material, a lower layer constituted with one or two or more selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu, on the lower layer, an intermediate layer,on the intermediate layer, an upper layer constituted with an alloy comprising one or two selected from a constituent element group B consisting of Sn and In and one or two or more selected from a constituent element group C consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and on the upper layer, a treated layer having C content being 60at% or more and O content being 30at% or less. The intermediate layer consists of one or two or more selected from the constituent element group A and one or two selected from the constituent element group B, and when the metallic material is heated at 250 °C for 30 seconds, an area ratio of oxide particles adhering to a surface of the treated layer is 0.1 % or less.