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HIGH-FREQUENCY INDUCTION HEATING HEAD, AND HIGH-FREQUENCY INDUCTION HEATING DEVICE WITH USE THEREOF

机译:高频感应加热头以及使用该高频感应加热头的高频感应加热装置

摘要

To provide a high-frequency induction heating head and a high-frequency induction heating device with use of the same for improving productivity.SOLUTION: A high-frequency induction heating head comprises: core bodies 8, 9 in which heating parts 8c, 9c provided on respective tip sides thereof are so located on one side surface of a printed wiring board 3 as to face each other with a first gap therebetween; and a movable mechanism which can move at least one of these core bodies 8, 9, and adjusts a distance of the first gap interposed between a heating part 8c of the core body and a heating part 9c of the core body 9. The core bodies 8, 9 are magnetically coupled at shaft support parts 8a, 9a other than the heating parts 8c, 9c of the core bodies 8, 9 via a second gap smaller than the first gap which exists between the heating parts 8c, 9c of the core bodies 8, 9 during heating.SELECTED DRAWING: Figure 1
机译:为了提供一种高频感应加热头和使用该高频感应加热头的高频感应加热装置,以提高生产率。解决方案:高频感应加热头包括:芯体8、9,其中设置有加热部件8c,9c。在其各自的顶端侧位于印刷线路板3的一个侧表面上,从而彼此面对,并在它们之间具有第一间隙。以及可移动机构,其可移动这些芯体8、9中的至少一个,并调节插入在芯体的加热部8c与芯体9的加热部9c之间的第一间隙的距离。如图8、8所示,通过比存在于芯体的加热部8c,9c之间的第一间隙小的第二间隙,在除芯体8、9的加热部8c,9c以外的轴支承部8a,9a处磁耦合。 8、9在加热过程中。

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