首页> 外国专利> HEAT INSULATION WALL PENETRATION ARRANGEMENT STRUCTURE OF WIRING/PIPING MATERIAL, HEAT INSULATION BLOCK BODY, AND HEAT INSULATION WALL PENETRATION PART FORMING DEVICE

HEAT INSULATION WALL PENETRATION ARRANGEMENT STRUCTURE OF WIRING/PIPING MATERIAL, HEAT INSULATION BLOCK BODY, AND HEAT INSULATION WALL PENETRATION PART FORMING DEVICE

机译:配线/配管材料,隔热块体以及隔热壁贯穿件的形成装置的隔热壁贯穿构造的构造

摘要

PROBLEM TO BE SOLVED: To provide a heat insulation wall penetration arrangement structure of a wiring/piping material which can easily obtain a desired heat insulation property and is favorable in appearance.;SOLUTION: A heat insulation wall penetration arrangement structure 3 of a wiring/piping material comprises a block-shaped heat insulation block body 5 having a heat insulation property and formed with a through-hole 5a. The heat insulation block body 5 comprises a fixed face 5b at which the through-hole 5a is opened, the fixed face 5b faces a one-side face 1c of a heat insulation wall 1, and the through-hole 5a is formed at the one-side face 1c so as to communicate with a penetration hole 1b of the heat insulation wall 1. The wiring/piping material 2 is arranged so as to pass through the penetration hole 1b and the through-hole 5a. The through-hole 5a is charged with a filler 6 composed of a foaming heat insulation material so as to block an air gap around the wiring/piping material 2 in the through-hole 5a.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2020,JPO&INPIT
机译:解决的问题:提供一种布线/管道材料的隔热壁穿透布置结构,其可以容易地获得期望的隔热性能并且外观良好。;解决方案:布线/管道的隔热壁穿透布置结构3管道材料包括具有隔热性能并形成有通孔5a的块状隔热块体5。隔热块体5包括固定面5b,通孔5a在该固定面5b处开口,该固定面5b面对隔热壁1的一侧表面1c,并且通孔5a形成在该固定面5b上。侧面1c与隔热壁1的贯通孔1b连通。配线配线材料2以贯通贯通孔1b和贯通孔5a的方式配置。通孔5a填充有由泡沫隔热材料制成的填充物6,以堵塞通孔5a中布线/管道材料2周围的气隙。;选择图:图1;版权:(C 2020年,日本特许厅&INPIT

著录项

  • 公开/公告号JP2020024019A

    专利类型

  • 公开/公告日2020-02-13

    原文格式PDF

  • 申请/专利权人 MIRAI IND CO LTD;

    申请/专利号JP20180149407

  • 发明设计人 IKEBA KENJI;

    申请日2018-08-08

  • 分类号F16L5;F25D23;F24F13/02;H02G3/22;

  • 国家 JP

  • 入库时间 2022-08-21 11:36:48

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