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Measuring instrument, etching system, silicon concentration measurement method, and silicon concentration measurement program
Measuring instrument, etching system, silicon concentration measurement method, and silicon concentration measurement program
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机译:测量仪器,蚀刻系统,硅浓度测量方法和硅浓度测量程序
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摘要
The invention provides a measuring instrument, an etching system, a silicon concentration measurement method and a silicon concentration measurement program. According to an embodiment, the measuringinstrument is provided, and includes an input/output unit, a memory, and a processor. Measurement value information indicating the concentrations of phosphoric acid, second acid and water in measurement target liquid is input into the input/output unit. The measurement target liquid contains phosphoric acid, second acid having a smaller dissociation index pK than the first acid dissociation indexpKa1 of the phosphoric acid, and water. The memory holds variation value information including the relationship between the concentration changes of phosphoric acid, the second acid and water when thesilicon is added so as to become a reference silicon concentration in reference liquid, and the reference silicon concentration. The reference liquid contains phosphoric acid, second acid and water.The processor obtains the silicon concentration of the measurement target liquid, as the measurement value information, based on the measurement value information inputted to the input/output unit andvariation value information read from the memory.
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