Curable resin composition, and film, molded article, prepreg and fiber reinforced plastic using the same

摘要

A curable resin composition including components (A), (B), (C) and (D) below: component (A): a bisphenol epoxy resin with a softening point of 80° C. or more, component (B): a bisphenol epoxy resin which is liquid at 25° C., component (C): a bi- or more-functional (meth)acrylate compound, and component (D): a curing agent.