A resin composition contains 100 parts by weight of a polypropylene-based resin. 17.6 parts by weight or more and less than 33.4 parts by weight of conductive carbon black, and 0.1 parts by weight or more and 3.0 parts by weight or less of a water-soluble organic substance, the resin composition having a melting point Tm of 145°C or more and 155°C or less as measured by a differential scanning calorimetry (DSC) method, and having a temperature difference ”T of 50°C or more between the melting point Tm and the crystal melting start temperature Tl in the DSC curve.
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