首页> 外国专利> ELECTROSTATIC CHUCK, FOCUS RING, SUPPORT PLATFORM, PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

ELECTROSTATIC CHUCK, FOCUS RING, SUPPORT PLATFORM, PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

机译:静电卡盘,聚焦环,支撑平台,等离子处理设备和等离子处理方法

摘要

To provide an electrostatic chuck that can decrease a difference between an electric field above a substrate and an electric field above a focus ring, and that can suppress its damage due to plasma processing.SOLUTION: An electrostatic chuck according to an exemplary embodiment comprises a first region and a second region. The first region has a first upper surface. The first region is constituted to hold a substrate mounted on the first upper surface. The second region has a second upper surface. The second region is extended in a circumferential direction so as to surround the first region. The second region is constituted to support a focus ring mounted on the second upper surface. The first upper surface and the second upper surface are extended along a single flat surface. The first region and the second region provide a space which isolates between the first upper surface and the second upper surface from each other.SELECTED DRAWING: Figure 2
机译:提供一种静电吸盘,该静电吸盘可以减小基板上方的电场与聚焦环上方的电场之间的差,并且可以抑制由于等离子体处理引起的静电吸盘。解决方案:根据示例性实施例的静电吸盘包括第一吸盘。区域和第二区域。第一区域具有第一上表面。第一区域构成为保持安装在第一上表面上的基板。第二区域具有第二上表面。第二区域在周向上延伸以围绕第一区域。第二区域构成为支撑安装在第二上表面上的聚焦环。第一上表面和第二上表面沿着单个平坦表面延伸。第一区域和第二区域提供了一个在第一上表面和第二上表面之间相互隔离的空间。

著录项

  • 公开/公告号JP2019216163A

    专利类型

  • 公开/公告日2019-12-19

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20180111972

  • 申请日2018-06-12

  • 分类号H01L21/3065;H01L21/683;H05H1/46;

  • 国家 JP

  • 入库时间 2022-08-21 11:34:27

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