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Compound semiconductor polycrystal, method for producing compound semiconductor single crystal, and method for producing compound semiconductor polycrystal
Compound semiconductor polycrystal, method for producing compound semiconductor single crystal, and method for producing compound semiconductor polycrystal
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机译:化合物半导体多晶,化合物半导体单晶的制造方法以及化合物半导体多晶的制造方法
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摘要
PROBLEM TO BE SOLVED: To provide an InP polycrystal raw material capable of improving a single crystallization rate to improve the yield of single crystal in the manufacturing of an InP single crystal by a liquid encapsulated Czochralski method (a LEC method), and a method for manufacturing the same.SOLUTION: The InP polycrystal has a grain size of 0.1-1.0 μm and an inclusion density of 1×103 cm-2 or less. A method for manufacturing an InP polycrystal comprises: arranging a solid P101, a vessel 104 for holding metal In103 and a shield body 105 including a structure having a plurality of plates connected by a hollow cylindrical body and having a space of 1-5 mm at a place having the farthest distance between the outer periphery of the surface of the plate and the inner surface of a seal ampule 102, in the seal ampule 102; opening a circulation port having a diameter of 15 mm or less and circulating P steam on the inner side by 5-10 mm than the outer periphery of the surface of the plate; sequentially arranging the plates to be shifted at an angle of 60-120° between adjacent plates; and synthesizing the InP polycrystal in the vessel 104 by a horizontal Bridgeman method.SELECTED DRAWING: Figure 1
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