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Compound semiconductor polycrystal, method for producing compound semiconductor single crystal, and method for producing compound semiconductor polycrystal

机译:化合物半导体多晶,化合物半导体单晶的制造方法以及化合物半导体多晶的制造方法

摘要

PROBLEM TO BE SOLVED: To provide an InP polycrystal raw material capable of improving a single crystallization rate to improve the yield of single crystal in the manufacturing of an InP single crystal by a liquid encapsulated Czochralski method (a LEC method), and a method for manufacturing the same.SOLUTION: The InP polycrystal has a grain size of 0.1-1.0 μm and an inclusion density of 1×103 cm-2 or less. A method for manufacturing an InP polycrystal comprises: arranging a solid P101, a vessel 104 for holding metal In103 and a shield body 105 including a structure having a plurality of plates connected by a hollow cylindrical body and having a space of 1-5 mm at a place having the farthest distance between the outer periphery of the surface of the plate and the inner surface of a seal ampule 102, in the seal ampule 102; opening a circulation port having a diameter of 15 mm or less and circulating P steam on the inner side by 5-10 mm than the outer periphery of the surface of the plate; sequentially arranging the plates to be shifted at an angle of 60-120° between adjacent plates; and synthesizing the InP polycrystal in the vessel 104 by a horizontal Bridgeman method.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种InP多晶原料及其制造方法,该InP多晶原料能够提高单晶化率,从而在通过液封的直拉法制造InP单晶的过程中提高单晶的产率。解决方案:InP多晶的晶粒尺寸为0.1-1.0μm,夹杂物密度为1×103 cm-2或更小。制造InP多晶的方法包括:布置固体P101,用于容纳金属In103的容器104和屏蔽体105,屏蔽体105包括具有通过中空圆柱体连接的多个板并且在1-5mm的空间的结构。在密封安瓿102中,板的表面的外周与密封安瓿102的内表面之间的距离最远的位置。打开直径为15mm或更小的循环口,并使P蒸汽在内侧循环,比板表面的外周长5-10mm。在相邻的板之间顺序地将要移动的板以60-120°的角度布置;然后通过水平布里奇曼方法在容器104中合成InP多晶。选图:图1

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