How to prepare mold for hot embedding device and resin embedding sample

摘要

PROBLEM TO BE SOLVED: To provide a mold for hot mounting apparatus and a method for preparing a resin embedded sample reducing a preparation time of a resin embedded sample.SOLUTION: A mold 2 for hot mounting apparatus includes: a cylinder 21; an upper ram 22 provided in an upper portion of the cylinder 21; a lower ram 23 provided in a lower portion of the cylinder 21; one or a plurality of intermediate rams 24 being inserted into an inner portion of the cylinder 21 and dividing a filling space between the upper ram 22 and the lower ram 23 into a plurality of spaces. A sample material is filled into each of the plurality of filling spaces divided by the intermediate rams 24. A plurality of resin embedded samples 1 are prepared by a single processing of a hot mounting apparatus. Therefore, a preparation time per resin embedded sample 1 is reduced.SELECTED DRAWING: Figure 1