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FBG temperature sensor

机译:FBG温度传感器

摘要

PROBLEM TO BE SOLVED: To provide an FBG temperature sensor that can further accurately measure a temperature of a narrow area where detection has been conventionally difficult.SOLUTION: A main body part 3 has a through-hole 31 into which an optical fiber 2 is inserted. Further, the main body part 3 cantilever-supports the optical fiber 2 inserted into the through-hole 31 on one side of an FBG part 21. A heat reception part 4 contacts with a temperature detection object. A thermal conductivity part 5 is arranged at a space with the optical fiber 2 in a state of surrounding a periphery of the FBG part 21. Further, the thermal conductivity part 5 is thermally connected to the heat reception part 4. A coupling part 35 is provided in the main body part 3. The coupling part 35 supports an outer peripheral surface of the heat reception part 4 or an outer peripheral surface of the thermal conductivity part 5, and thereby fixes the heat reception part 4 to the main body part 3. In the foregoing configuration, the coupling part 35 is composed of a material lower in a thermal conductivity than the heat reception part 4 and the thermal conductivity part 5.SELECTED DRAWING: Figure 2
机译:解决的问题:提供一种FBG温度传感器,该FBG温度传感器可以进一步准确地测量传统上难以检测的狭窄区域的温度。解决方案:主体部分3具有通孔31,光纤2插入该通孔31中。 。此外,主体部3在FBG部21的一侧悬臂支撑插入到通孔31中的光纤2。受热部4与温度检测对象接触。在包围FBG部21的周围的状态下,在与光纤2隔开间隔的位置配置有导热部5。此外,导热部5与受热部4热连接。连接部35与光纤2连接。结合部35支撑热接收部4的外周面或热传导部5的外周面,从而将热接收部4固定在主体部3上。在前述构造中,联接部35由导热率比受热部4和导热率部5低的材料构成。

著录项

  • 公开/公告号JP6736042B2

    专利类型

  • 公开/公告日2020-08-05

    原文格式PDF

  • 申请/专利权人 株式会社シミウス;

    申请/专利号JP20160177171

  • 发明设计人 若原 正人;

    申请日2016-09-09

  • 分类号G01K11/32;

  • 国家 JP

  • 入库时间 2022-08-21 11:32:48

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