Copper powder for additive manufacturing and additive manufacturing body thereof

摘要

The present invention provides a copper powder for additive manufacturing in which phosphorus (P) is added so that a high density additive manufacturing body can be obtained by an additive manufacturing method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper. Since it was developed, it is possible to obtain a high-density layered product with high electric conductivity. The present invention is a copper powder for additive manufacturing in which phosphorus element is added to pure copper. The copper powder for additive manufacturing desirably contains 0.01% by weight or more of phosphorus element. Further, it is desirable that the copper powder for additive manufacturing contain 0.04% by weight or more of phosphorus element. Further, it is desirable that the copper powder for additive manufacturing contain 0.30% by weight or less of phosphorus element. Moreover, it is desirable that the copper powder for additive manufacturing contain 0.24 wt% or less of phosphorus element. Further, it is desirable that the additive copper powder does not contain any element other than phosphorus.