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Critical dimension variation correction in extreme ultraviolet lithography
Critical dimension variation correction in extreme ultraviolet lithography
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机译:极限紫外光刻中的关键尺寸变化校正
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摘要
A method of correcting a critical dimension (CD) variation in extreme ultraviolet (EUV) photolithography includes mapping the CD variation of a wafer exposure field formed by a photolithography system that includes an EUV photolithography photomask. Parameters of a treatment to produce a change in reflectance at a working wavelength of EUV radiation in a region of a reflective multilayer of the photomask are determined, the change in reflectance being calculated to correct the mapped CD variation. A treatment beam is directed to the region. The region is treated with the beam in accordance with the determined parameters.
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