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Laser machining apparatus and laser machining method for performing laser machining while controlling reflected light

机译:用于在控制反射光的同时进行激光加工的激光加工设备和激光加工方法

摘要

A laser machining method includes the steps of: outputting a laser beam to the workpiece at a laser power low enough not to melt or oxidize the workpiece to measure reflected light of the laser beam; selecting a laser power suitable for melting or oxidizing the workpiece based on a measured value of the reflected light; determining whether or not the workpiece can be melted or oxidized based on the selected laser power; when the workpiece can be melted or oxidized, outputting a laser beam to the workpiece at a laser power high enough to melt or oxidize the workpiece; outputting again a laser beam to the workpiece at the low laser power to measure reflected light of the laser beam; and checking the degree of the melting or oxidization of the workpiece based on a measured value of the reflected light to determine whether or not to start laser machining.
机译:激光加工方法包括以下步骤:以足够低的激光功率将激光束输出到工件,以不熔化或氧化工件以测量激光束的反射光;以及根据反射光的测量值选择适合于熔化或氧化工件的激光功率;根据所选择的激光功率确定工件是否可以熔化或氧化;当工件可以熔化或氧化时,以足以熔化或氧化工件的激光功率向工件输出激光束;再以低激光功率将激光束输出到工件,以测量激光束的反射光。根据反射光的测量值检查工件的熔化或氧化程度,以确定是否开始激光加工。

著录项

  • 公开/公告号US10537964B2

    专利类型

  • 公开/公告日2020-01-21

    原文格式PDF

  • 申请/专利权人 FANUC CORPORATION;

    申请/专利号US201715593704

  • 发明设计人 TAKASHI IZUMI;

    申请日2017-05-12

  • 分类号B23K26/03;B23K26/60;B23K26/70;

  • 国家 US

  • 入库时间 2022-08-21 11:28:02

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