首页> 外国专利> Process for treating silica-filled polyamide by impregnation in supercritical CO2

Process for treating silica-filled polyamide by impregnation in supercritical CO2

机译:在超临界二氧化碳中浸渍处理二氧化硅填充聚酰胺的方法

摘要

The present invention relates to a process for treating a polyamide-based material comprising silica fibers and/or fillers, by impregnation with at least one hydrophobic additive in supercritical CO2.;The invention also relates to a polyamide-based material comprising silica fibers and/or fillers and impregnated with at least one hydrophobic additive, obtained via such a process, and to the use thereof as an electrically insulating component in an electrical device, in particular in a circuit breaker.
机译:本发明涉及一种通过在超临界CO 2 -Sub中浸渍至少一种疏水性添加剂来处理包含二氧化硅纤维和/或填料的聚酰胺基材料的方法。本发明还涉及一种聚酰胺。包含二氧化硅纤维和/或填料并浸渍有至少一种疏水性添加剂的硅基材料,该材料通过这种方法获得,并用作电气设备,特别是断路器中的电绝缘组件。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号