首页> 外国专利> RESIN COMPOSITION FOR ACOUSTIC MATCHING LAYER, CURED PRODUCT, ACOUSTIC MATCHING SHEET, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASURING APPARATUS, METHOD FOR MANUFACTURING ACOUSTIC WAVE PROBE, AND MATERIAL SET FOR ACOUSTIC MATCHING LAYER

RESIN COMPOSITION FOR ACOUSTIC MATCHING LAYER, CURED PRODUCT, ACOUSTIC MATCHING SHEET, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASURING APPARATUS, METHOD FOR MANUFACTURING ACOUSTIC WAVE PROBE, AND MATERIAL SET FOR ACOUSTIC MATCHING LAYER

机译:声学匹配层的树脂组成,固化产品,声学匹配表,声学波探头,声学波测量装置,制造声学波探头的方法以及声学匹配层的材料套件

摘要

A resin composition, for an acoustic matching layer, that contains a binder including a resin and surface-treated metal particles; a cured product formed from the composition; an acoustic matching sheet; an acoustic wave probe; an acoustic wave measuring apparatus; a method for manufacturing an acoustic wave probe; and a material set, for an acoustic matching layer, that is suitable for preparation of the composition.
机译:1。一种用于声匹配层的树脂组合物,其包含粘合剂和树脂,所述粘合剂包括树脂和经表面处理的金属颗粒。由所述组合物形成的固化产物;声学匹配表;声波探头;声波测量装置;一种声波探头的制造方法;用于声学匹配层的材料组,其适合于制备组合物。

著录项

  • 公开/公告号US2020253582A1

    专利类型

  • 公开/公告日2020-08-13

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORPORATION;

    申请/专利号US202016863096

  • 发明设计人 YOSHIHIRO NAKAI;KAZUHIRO HAMADA;

    申请日2020-04-30

  • 分类号A61B8;C08K9/06;C08K9/02;H04R17;

  • 国家 US

  • 入库时间 2022-08-21 11:27:07

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