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DEBT REPAYMENT SYSTEM AND DEBT MANAGEMENT METHOD

机译:债务偿还系统和债务管理方法

摘要

A debt repayment system and a debt management method are provided. In the method, a transaction via a purchase carrier is received, and a purchase amount is obtained. The purchase carrier includes a physical or virtual card for pay. Repayment plans for first and second stages are determined according to a total debt and the purchase amount. A first repayment in the repayment plan of the first stage relates to interest repayment without principal for the total debt, and a second repayment in the repayment plan of the second stage relates to interest repayment with principal for the total debt. A repayment transferred from a repay account is determined according to a debt ratio of each credit bank. The repay account is used for saving the first or second repayment and a rebate of the purchase amount. Accordingly, the debt is easier to be managed.
机译:提供了一种债务偿还系统和债务管理方法。在该方法中,经由购买载体接收交易,并且获得购买金额。购买载体包括用于支付的实体卡或虚拟卡。根据债务总额和购买金额确定第一阶段和第二阶段的还款计划。第一阶段的还款计划中的第一笔还款涉及不计本金的总债务利息偿还,第二阶段的还款计划中的第二笔还款涉及具有本金的总债务利息还款。从还款账户转账的还款额是根据每个信贷银行的债务比率确定的。还款账户用于保存第一笔或第二笔还款以及购买金额的回扣。因此,债务更易于管理。

著录项

  • 公开/公告号US2020327514A1

    专利类型

  • 公开/公告日2020-10-15

    原文格式PDF

  • 申请/专利权人 CHIA-YEH HSU;

    申请/专利号US201916593949

  • 发明设计人 CHIA-YEH HSU;

    申请日2019-10-04

  • 分类号G06Q20/10;G06Q20/24;

  • 国家 US

  • 入库时间 2022-08-21 11:26:06

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