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SYSTEM FOR PLACEMENT OPTIMIZATION OF CHIP DESIGN FOR TRANSIENT NOISE CONTROL AND RELATED METHODS THEREOF

机译:瞬态噪声控制芯片设计的位置优化系统及其相关方法

摘要

Transient voltage noise, including resistive and reactive noise, causes timing errors at runtime. A heuristic framework, Walking Pads, is introduced to minimize transient voltage violations by optimizing power supply pad placement. It is shown that the steady-state optimal design point differs from the transient optimum, and further noise reduction can be achieved with transient optimization. The methodology significantly reduces voltage violations by balancing the average transient voltage noise of the four branches at each pad site. When pad placement is optimized using a representative stressmark, voltage violations are reduced 46-80% across 11 Parsec benchmarks with respect to the results from IR-drop-optimized pad placement. It is shown that the allocation of on-chip decoupling capacitance significantly influences the optimal locations of pads.
机译:瞬态电压噪声(包括电阻性和电抗性噪声)会在运行时引起时序误差。引入了一种启发式框架,Walking Pads,以通过优化电源焊盘的位置来最大程度地减少瞬态电压违规。结果表明,稳态最优设计点与瞬态最优不同,通过瞬态优化可以进一步降低噪声。该方法通过平衡每个焊盘位置上四个分支的平均瞬态电压噪声来显着减少电压违规。当使用代表应力标记优化焊盘放置时,相对于IR压降优化的焊盘放置结果,在11个Parsec基准测试中,电压违规减少了46-80%。结果表明,片上去耦电容的分配会显着影响焊盘的最佳位置。

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