Integrated magnetics techniques for incorporating inductor, coupled inductor, and/or transformer functions of power electronics and high frequency circuits onto small, integrated structures, while maintaining a high quality factor and a high inductance density. The integrated magnetics techniques include incorporating magnetic vias into the inductive elements to form closed magnetic loops for reducing the reluctance to magnetic flux, while increasing the inductance of the inductive elements. The small integrated structures can be configured as integrated laminate structures, in which multiple layers of semiconductor chips, magnetic layers, capacitive layers, conductive layers, and/or dielectric layers are vertically laminated together to form electronic circuits for use in smart phones, tablet computers, notebook computers, wearable electronic devices, portable medical devices, server computers, networking equipment, industrial equipment, and/or any other suitable devices, computers, systems, and/or equipment.
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