USE OF DUAL OVENABLE POLYESTER FILMS IN THERMOFORMING PACKAGING APPLICATIONS AND DUAL OVENABLE THERMOFORMED PACKAGES OBTAINED THEREFROM

摘要

The present invention relates to thermoforming food packaging methods and to dual ovenable thermoformed food packages suitable for cooking food products directly in the package in microwave, conventional and convection ovens. These packages are characterized by good hermeticity, clean peelability, self-venting, very good optics and, if shrunk, a very appealing appearance.