首页> 外国专利> ALUMINUM ALLOY MATERIAL, AND CONDUCTIVE MEMBER, CONDUCTIVE COMPONENT, SPRING MEMBER, SPRING COMPONENT, SEMICONDUCTOR MODULE MEMBER, SEMICONDUCTOR MODULE COMPONENT, STRUCTURAL MEMBER AND STRUCTURAL COMPONENT INCLUDING THE ALUMINUM ALLOY MATERIAL

ALUMINUM ALLOY MATERIAL, AND CONDUCTIVE MEMBER, CONDUCTIVE COMPONENT, SPRING MEMBER, SPRING COMPONENT, SEMICONDUCTOR MODULE MEMBER, SEMICONDUCTOR MODULE COMPONENT, STRUCTURAL MEMBER AND STRUCTURAL COMPONENT INCLUDING THE ALUMINUM ALLOY MATERIAL

机译:铝合金材料和导电部件,导电部件,弹簧部件,弹簧部件,半导体模块部件,半导体模块部件,包括铝合金的结构部件和结构部件

摘要

An object of the present disclosure is to provide a high strength aluminum alloy material having a ribbon shape, which can be an alternative to copper-based materials and iron-based materials having a ribbon shape, and a conductive member, a conductive component, a spring member, a spring component, a semiconductor module member, a semiconductor module component, a structural member and a structural component including the aluminum alloy material. The aluminum alloy material of the present disclosure has an alloy composition containing Mg: 0.2% to 1.8% by mass, Si: 0.2% to 2.0% by mass, and Fe: 0.01% to 1.50% by mass, with the balance being Al and inevitable impurities, wherein the aluminum alloy material has a Vickers hardness (HV) of 90 or more and 190 or less and has a ribbon shape.
机译:本公开的目的是提供一种具有带状形状的高强度铝合金材料,其可以替代具有带状形状的铜基材料和铁基材料,以及导电构件,导电部件,弹簧部件,弹簧部件,半导体模块部件,半导体模块部件,结构部件和包括铝合金材料的结构部件。本发明的铝合金材料的合金组成为:Mg:0.2质量%〜1.8质量%,Si:0.2质量%〜2.0质量%,Fe:0.01质量%〜1.50质量%,余量为Al和不可避免的杂质,其中,铝合金材料的维氏硬度(HV)为90以上且190以下,并且为带状。

著录项

  • 公开/公告号US2020017938A1

    专利类型

  • 公开/公告日2020-01-16

    原文格式PDF

  • 申请/专利权人 FURUKAWA ELECTRIC CO. LTD.;

    申请/专利号US201916580965

  • 发明设计人 HIROSHI KANEKO;

    申请日2019-09-24

  • 分类号C22C21/08;C22F1/047;F16F1/02;H01B1/02;H01L23;

  • 国家 US

  • 入库时间 2022-08-21 11:23:45

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