首页> 外国专利> Exposure device for a photolithography method, assembly having an exposure device and method for exposing a substrate coated with a photoresist

Exposure device for a photolithography method, assembly having an exposure device and method for exposing a substrate coated with a photoresist

机译:用于光刻方法的曝光设备,具有曝光设备的组件以及用于曝光涂覆有光致抗蚀剂的基板的方法

摘要

Exposure device (12) for a photolithography method, comprising a light source (16), a lens mask (18) and a chuck (34). The lens mask (18) is provided between light source (16) and chuck (34), is disposed substantially parallel to the chuck (34) and comprises at least two focussing elements (42), each with a focal point (44). The exposure device (12) is arranged such that during exposure all focussing elements (42) of the lens mask (18) are always illuminated by the light source (16). An assembly (10) is provided with a substrate (14), in particular a wafer, and said exposure device (12). The substrate (14) is disposed on the chuck (34). The number of focussing elements (42) of the lens mask (18) corresponds to a number of the dies (48) provided on the substrate (14). A method for exposing a substrate (14) coated with a photoresist is described.
机译:用于光刻方法的曝光装置(12),包括光源(16),透镜掩模(18)和卡盘(34)。透镜掩模(18)设置在光源(16)和卡盘(34)之间,基本上平行于卡盘(34)设置并且包括至少两个聚焦元件(42),每个聚焦元件具有焦点(44)。曝光装置(12)被布置成使得在曝光期间,透镜罩(18)的所有聚焦元件(42)总是被光源(16)照明。组件(10)设置有基板(14),特别是晶片,以及所述曝光装置(12)。基板(14)配置在卡盘(34)上。透镜掩模(18)的聚焦元件(42)的数量对应于设置在基板(14)上的管芯(48)的数量。描述了一种曝光涂覆有光致抗蚀剂的基板(14)的方法。

著录项

  • 公开/公告号NL2021649B1

    专利类型

  • 公开/公告日2020-05-07

    原文格式PDF

  • 申请/专利权人 SUSS MICROTEC LITHOGRAPHY GMBH;

    申请/专利号NL2021649A

  • 发明设计人 UWE VOGLER;

    申请日2018-09-17

  • 分类号G03F7/20;

  • 国家 NL

  • 入库时间 2022-08-21 11:16:54

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号