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PROCEDURE FOR THE MANUFACTURE OF A MICRO-ECONOMIC DEVICE WITH A SEPARATE SUSPENSIBLE STRUCTURE AND MICRO-ECONOMIC DEVICE
PROCEDURE FOR THE MANUFACTURE OF A MICRO-ECONOMIC DEVICE WITH A SEPARATE SUSPENSIBLE STRUCTURE AND MICRO-ECONOMIC DEVICE
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机译:具有单独的易变结构和微经济装置的微经济装置的制造程序
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摘要
A process for manufacturing a microelectromechanical device envisages: providing a wafer of semiconductor material; forming a buried cavity, completely contained within the wafer, and a structural layer formed by a surface portion of the wafer and suspended over the buried cavity; forming first trenches through the structural layer as far as the buried cavity, which define the suspended structure in the structural layer; filling the first trenches and the buried cavity with sacrificial material; forming a closing structure above the structural layer; removing the sacrificial material from the first trenches and from the buried cavity to release the suspended structure, the suspended structure being isolated and buried within the wafer in a buried environment formed by the first trenches and by the buried cavity.
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