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Composition of electrically insulating, thermally conductive polymeric resin, based on styrenic compounds with balanced properties

机译:基于具有平衡性能的苯乙烯化合物的电绝缘,导热聚合物树脂的组成

摘要

A thermoconductive polymer (TCP) resin composition (i) or (ii) comprising components (I) and (II): (i) from 40 to 72% by volume of at least one matrix polymer (I) as component (I); 28 to 60% by volume of a heat-conducting filler (II) as component (II) having a weight average particle diameter (D50) of 0.1 to 200 μm, consisting of at least one aluminosilicate as component (II-1) combined with at least one additional component (II-2) selected from the group consisting of: multi-walled carbon nanotubes, graphite and boron nitride, where the volume ratio between components (II-1) and (II-2) is from 30: 1 to 0.1: 1; or (ii) from 40 to 65% by volume of at least one matrix polymer (I) as component (I); 35 to 60% by volume of a heat conductive filler (II) as component (II) having a weight average particle diameter (D50) of 0.1 to 200 µm consisting of at least one aluminosilicate; wherein the matrix polymer (I) comprises styrenic polymers (I ') selected from the group consisting of: ABS resins (acrylonitrile-butadiene-styrene), ASA resins (acrylonitrile-styrene-acrylate) and elastomeric block copolymers of structure (S - (B / S)) nS where S is a vinyl aromatic block that forms a hard phase, (B / S) is a random copolymer block of vinyl aromatic monomer and a conjugated diene that forms a soft phase, and n are natural numbers of 1 to 10, wherein the elastomeric block copolymer has a monomer composition comprising 25 to 60% by weight (based on the elastomeric block copolymer) of diene and 75 to 40% by weight (based on the copolymer in elastomeric block) of vinyl aromatic compound, the glass transition temperature Tg of block S is higher than 25 ° C and that of block (B / S) is lower than 25 ° C, and the proportion of the hard phase in the block copolymer elastomeric is 5 to 40% by weight and the relative amount of bonds 1,2 of the polydiene, based on the sum of 1,2 and 1,4 cis / trans bonds, is less than 15%; and wherein the sum of components (I) and (II) total 100% by volume, and wherein the surface of the aluminosilicate is treated with a coupling agent.
机译:包含组分(I)和(II)的导热聚合物(TCP)树脂组合物(i)或(ii):(i)40-72体积%的至少一种基质聚合物(I)作为组分(I);作为成分(II)的导热填料(II)的体积百分比为28%至60%,由至少一种作为成分(II-1)的硅铝酸盐与至少一种选自以下的另外的组分(II-2):多壁碳纳米管,石墨和氮化硼,其中组分(II-1)和(II-2)之间的体积比为30:1到0.1:1; (ii)40至65体积%的至少一种基质聚合物(I)作为组分(I);或35〜60体积%的导热填料(II)作为组分(II),其重均粒径(D50)为0.1至200μm,由至少一种硅铝酸盐组成;其中基体聚合物(I)包括选自以下的苯乙烯类聚合物(I'):ABS树脂(丙烯腈-丁二烯-苯乙烯),ASA树脂(丙烯腈-苯乙烯-丙烯酸酯)和结构(S-( (B / S))nS其中S是形成硬相的乙烯基芳族嵌段,(B / S)是形成软相的乙烯基芳族单体和共轭二烯的无规共聚物嵌段,n是1的自然数10至10,其中弹性体嵌段共聚物的单体组成包含25至60重量%(基于弹性体嵌段共聚物)的二烯和75至40重量%(基于弹性体嵌段中的共聚物)的乙烯基芳族化合物,嵌段S的玻璃化转变温度Tg高于25℃,嵌段(B / S)的玻璃化转变温度Tg低于25℃,并且在嵌段共聚物弹性体中硬相的比例为5至40重量%,并且基于1,2之和的聚二烯键1,2的相对数量1,4个顺/反键小于15%;其中组分(I)和(II)的总和为100体积%,并且其中硅铝酸盐的表面用偶联剂处理。

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