DEVICE AND SYSTEM FOR AUTOMATICALLY CONTROLLING THICKNESS OF ELECTROFORMED COATING

摘要

Provided are a device and system for automatically controlling the thickness of an electroformed coating. The device comprises an electroforming cylinder (1), a rack-plating bracket (2), a controller (3) and a current detection unit (4). The rack-plating bracket (2) is placed inside the electroforming cylinder (1). The current detection unit (4) detects the current of each rack-plating sample on the rack-plating bracket (2). The controller (3) obtains, according to the current, the quantity of charge used when performing electroplating on a rack-plating interface board (5), and if the quantity of charge reaches the expected quantity of charge of a sample (14) to be electroplated, the controller (3) stops supplying power to the corresponding sample (14) to be electroplated. Moreover, the total current of a programmable power supply is immediately adjusted according to the quantity of samples that are still energized at present. The solution greatly improves the online production efficiency and the quality control for pure gold electroforming.