COPPER FOIL PROCESSING METHOD, COPPER FOIL, LAMINATE, COPPER-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND MODULE CORRESPONDING TO HIGH-SPEED COMMUNICATION

摘要

Provided is a copper foil processing method by which, regardless of the type of resin composition or the type of resin of a resin layer to be laminated on a conductive layer, peeling off of the resin layer is unlikely to occur even after a reflow step. Further provided are a copper foil obtained by performing the copper foil processing method, and a laminate using the copper foil, a copper-clad laminated plate, a printed wiring board, and a module suitable for high-speed communication. Specifically, provided is a copper foil processing method including: a step (1) for forming a tin layer or a tin alloy layer on the surface of a copper foil; a step (2) for converting, to a tin oxide, tin present on the surface of the tin layer or the tin alloy layer; and a step (3) for performing a coupling process on the tin oxide.