首页> 外国专利> COPPER FOIL PROCESSING METHOD, COPPER FOIL, LAMINATE, COPPER-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND MODULE CORRESPONDING TO HIGH-SPEED COMMUNICATION

COPPER FOIL PROCESSING METHOD, COPPER FOIL, LAMINATE, COPPER-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND MODULE CORRESPONDING TO HIGH-SPEED COMMUNICATION

机译:铜箔加工方法,铜箔,叠层,铜包层板,印刷线路板以及与高速通信相对应的模块

摘要

Provided is a copper foil processing method by which, regardless of the type of resin composition or the type of resin of a resin layer to be laminated on a conductive layer, peeling off of the resin layer is unlikely to occur even after a reflow step. Further provided are a copper foil obtained by performing the copper foil processing method, and a laminate using the copper foil, a copper-clad laminated plate, a printed wiring board, and a module suitable for high-speed communication. Specifically, provided is a copper foil processing method including: a step (1) for forming a tin layer or a tin alloy layer on the surface of a copper foil; a step (2) for converting, to a tin oxide, tin present on the surface of the tin layer or the tin alloy layer; and a step (3) for performing a coupling process on the tin oxide.
机译:提供一种铜箔加工方法,通过该铜箔加工方法,不管树脂组合物的类型或要层压在导电层上的树脂层的树脂的类型如何,即使在回流步骤之后也不容易发生树脂层的剥离。还提供通过进行铜箔加工方法而获得的铜箔,以及使用该铜箔的层压体,覆铜层压板,印刷线路板和适合于高速通信的模块。具体地,提供了一种铜箔加工方法,其包括:步骤(1),用于在铜箔的表面上形成锡层或锡合金层。步骤(2),将存在于锡层或锡合金层的表面上的锡转化为氧化锡。步骤(3),用于对氧化锡进行偶联处理。

著录项

  • 公开/公告号WO2020017524A1

    专利类型

  • 公开/公告日2020-01-23

    原文格式PDF

  • 申请/专利权人 HITACHI CHEMICAL COMPANY LTD.;

    申请/专利号WO2019JP28003

  • 发明设计人 JONO KEITA;NAKANO MASAYUKI;

    申请日2019-07-17

  • 分类号B32B15/01;B32B15/08;C23C8/12;C23C18/31;C23C28;H05K3/38;

  • 国家 WO

  • 入库时间 2022-08-21 11:13:42

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