BUBBLE JETTING METHOD, BUBBLE JETTING DEVICE AND BUBBLE JETTING APPARATUS

摘要

The present invention addresses the problem of providing a bubble jetting method based on a new principle that is different from conventional bubble jetting methods with the use of a bubble jetting member (a bubble jetting tip), a bubble jetting device to be used in the bubble jetting method, and a bubble jetting apparatus comprising the bubble jetting device. To solve the problem, provided is a bubble jetting method using a bubble jetting device, wherein the bubble jetting device comprises: a substrate formed of a dielectric material; a bubble jetting hole which is formed so as to penetrate from a first surface of the substrate to a second surface thereof opposed to the first surface; a first opening which is formed on the first surface at a position where the bubble jetting hole penetrates; and a second opening which is formed on the second surface at a position where the bubble jetting hole penetrates. The bubble jetting method comprises: a substrate/electroconductive liquid contact step for bringing a part of the substrate, said part including at least the first and second openings, into contact with an electroconductive liquid; an electroconductive liquid/electrode contact step for bringing a first electrode into contact with the electroconductive liquid on the first opening side and also bringing a second electrode into contact with the electroconductive liquid on the second opening side; a voltage application step for applying a voltage to the first and second electrodes; and a bubble jetting step for jetting bubbles from the bubble jetting hole into the electroconductive liquid.