COARSENED BARE DIAMOND WIRE SAW AND METHOD FOR COARSENING DIAMOND

摘要

Provided is a coarsened bare diamond wire saw, comprising a base line (1), a metal coating (2) and diamond particles (3) embedded in the metal coating, the surfaces of the diamond particles being subjected to coarsening. The embedded depth of the diamond particles in the metal coating is denoted as H, the particle size of the diamond particles is denoted as D, and H is less than 2/3 D. Further provided is a method for coarsening diamond, comprising the following steps: weighing a certain amount of metal oxide, mixing the metal oxide with diamond, heating the mixture in a vacuum environment, preserving heat for a certain time, cooling the reacted mixture, and treating the cooled mixture by using an oxidizing acid. The coarsening of diamond particles enables the metal coating to better hold the diamond particles, and reduces the embedded depth of the diamond particles in the metal coating, thereby increasing the exposure height of the diamond particles, prolonging the service life of the diamond wire saw and improving the cutting quality.