首页>
外国专利>
THERMAL-DEPENDENT ADHESIVE FOR ELECTRONIC AND ELECTRICAL MATERIAL, ADHESIVE TAPE STRUCTURE AND PREPARATION PROCESS THEREOF
THERMAL-DEPENDENT ADHESIVE FOR ELECTRONIC AND ELECTRICAL MATERIAL, ADHESIVE TAPE STRUCTURE AND PREPARATION PROCESS THEREOF
展开▼
机译:电子和电气材料的热敏胶,胶粘带结构及其制备工艺
展开▼
页面导航
摘要
著录项
相似文献
摘要
Disclosed is a thermal-dependent adhesive for electronic and electrical material, comprising an acrylic acid copolymer resin. The weight percentage of the formulation of the acrylic acid copolymer resin comprises 33-41% of butyl acrylate, 31-37% of hydroxyethyl acrylate, 2-6% of ethyl acetate, 18-32% of artificial fiber rosin ester, and 1-3% of plastic hardener and elastic fiber. In the present invention, the formulation of the adhesive increases the peeling force of the reusable adhesive tape, improves the repeated use capability of the adhesive tape, and increases the service life of the bonding interface.
展开▼